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A6250 Datasheet(PDF) 2 Page - EM Microelectronic - MARIN SA

Part # A6250
Description  High Efficiency Linear Power Supply with Accurate Power Surveillance and Software Monitoring
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Manufacturer  EMMICRO [EM Microelectronic - MARIN SA]
Direct Link  http://www.emmicroelectronic.com
Logo EMMICRO - EM Microelectronic - MARIN SA

A6250 Datasheet(HTML) 2 Page - EM Microelectronic - MARIN SA

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Absolute Maximum Ratings
Parameter
Symbol Conditions
Continuous voltage at INPUT to
VSS
VINPUT
-0.3 to +45 V
Transients on INPUT for
t< 100 ms and duty cycle 1%
VTRANS
up to +60 V
Reverse supply voltage on INPUT VREV
-20 V
Max. voltage at any signal pin
VMAX
OUTPUT+0.3V
Min. voltage at any signal pin
VMIN
VSS-0.3V
Storage temperature
TSTO
-65 to +150°C
Operating junction temperature
TJ
max. 150 °C
Electrostatic discharge max. To
MIL-STD-883C method 3015
VSmax
1000V
Max. soldering conditions
TSmax
250°C x 10 s
Max. Output current
IOUTPUTmax
300 mA
Table 1
Stresses above these listed maximum ratings may cause
permanent damage to the device. Exposure beyond
specified operating conditions may affect device reliability
or cause malfunction.
Decoupling Methods
The input capacitor is necessary to compensate the line
influences. A resistor of approx. 1
Ω connected in series
with the input capacitor may be used to damp the oscilla-
tion of the input capacitor and input inductivity. The ESR
value of the capacitor plays a major role regarding the effi-
ciency of the decoupling. It is recommended also to con-
nect a ceramic capacitor (100 nF) directly at the IC’s pins.
In general the user must assure that pulses on the input
line have slew rates lower than 1 V/µs. On the output side,
the capacitor is necessary for the stability of the regulation
circuit. The stability is guaranteed for values of 22 µF or
bigger. It is specially important to choose a capacitor with
a low ESR value. Tantal capacitors are recommended.
See the notes related to Table 2. Special care must be
taken in disturbed environments (automotive, proximity of
motors and relays, etc.).
Handling Procedures
This device has built-in protection against high static volt-
ages or electric fields; however, anti-static precautions
must be taken as for any other CMOS component. Unless
otherwise specified, proper operation can only occur
when all terminal voltages are kept within the supply volt-
age range. Unused inputs must always be tied to a de-
fined logic voltage level.
Operating Conditions
Parameter
Symbol Min. Max. Units
Operating junction
temperature1)
TJ
-40
+125
°C
INPUT voltage 2)
VINPUT
2.3
40
V
OUTPUT voltage 2) 3)
VOUTPUT 1.2
V
RES & EN guaranteed 4)
VOUTPUT 1.2
V
OUTPUT current 5)
IOUTPUT
250
mA
Comparator input voltage
VIN
0
VOUTPUT
V
RC-oscillator programming 6)
R
10
1000
k
Thermal resistance from
junction to ambient 7)
- PSOP2-16
Rth(j-a)
30
90
°C/W
Table 2
1) The maximum operating temperature is confirmed by
sampling at initial device qualification. In production, all
devices are tested at +125°C.
2) Full operation guaranteed. To achieve the load regulation
specified in Table 3 a 22 µF capacitor or greater is required
on the INPUT, see Fig. 8. The 22 µF must have an effective
resistance
≤ 5 Ω and a resonant frequency above 500 kHz.
3) A 10 µF load capacitor and a 100 nF decoupling capacitor
are required on the regulator OUTPUT for stability. The 10 µF
must have an effective series resistance of
≤ 5 Ω and a
resonant frequency above 500 kHz.
4) RES must be pulled up externally to VOUTPUT even if it is
unused. (Note: RES and EN are used as inputs by EM test.)
5) The OUTPUT current will not apply for all possible
combinations of input voltage and output current.
Combinations that would require the A6250 to work above
the maximum junction temperature (+125 °C) must be
avoided.
6) Resistor values close to 1000 k
Ω are not recommended for
applications working at 125 °C.
7) The thermal resistance specified assumes the package is
soldered to a PCB. The termal resistance’s value depends on
the PCB’s structure. A typical value of 51 °C/W has been
obtained with a dual layer board, with the slug soldered to
the heat-sink area of the PCB (see Fig. 22).
2
A6250


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