TPS54317 datasheet(10/17 Pages) TI

Part #	TPS54317

Description	1.6 MHz, 3-V TO 6-V INPUT, 3-A SYNCHRONOUS STEP-DOWN SWIFT CONVERTER

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Manufacturer	TI [Texas Instruments]

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LAYOUT CONSIDERATIONS FOR THERMAL

PIN 1

0.1250

0.0120

24 x

0.0320

24 x

0.1182

0.0197

0.1620

0.0400

6 x 0.013 DIA

EXPOSED

POWERPAD

AREA

TPS54317

SLVS619A – NOVEMBER 2005 – REVISED FEBRUARY 2006

operation is desired. Connection from the exposed

area of the PowerPAD to the analog ground plane

layer should be made using 0.013 inch diameter vias

PERFORMANCE

to avoid solder wicking through the vias. Six vias

For operation at full rated load current, the analog

should be in the PowerPAD area additional vias

ground plane must provide adequate heat dissipating

located under the device package may be added to

area. A 3 inch by 3 inch plane of 1 ounce copper is

enhance thermal performance. The vias under the

recommended, though not mandatory, depending on

package, but not in the exposed thermal pad area,

ambient temperature and airflow. Most applications

can be increased in size to 0.018.

have larger areas of internal ground plane available,

and the PowerPAD should be connected to the

largest area available. Additional areas on the top or

bottom layers also help dissipate heat, and any area

available should be used when 3 A or greater

Figure 12. Recommended Land Pattern for 24-Pin QFN PowerPAD

10

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