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W3E32M64S-XSBX Datasheet(PDF) 2 Page - White Electronic Designs Corporation |
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W3E32M64S-XSBX Datasheet(HTML) 2 Page - White Electronic Designs Corporation |
2 / 17 page 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W3E32M64S-XSBX July 2006 Rev. 5 I/O Count I/O Count Area 4 x 265mm2 = 1060mm2 286mm2 73% 4 x 66 pins = 264 pins 208 Balls 21% Area 4 x 125mm2 = 500mm2 286mm2 43% 4 x 60 balls = 240 balls 208 Balls 13% S A V I N G S Actual Size W3E32M64S-XSBX 13 22 TSOP Approach (mm) 22.3 11.9 66 TSOP 66 TSOP 66 TSOP 66 TSOP 11.9 11.9 11.9 S A V I N G S CSP Approach (mm) 60 FBGA 10.0 60 FBGA 10.0 60 FBGA 10.0 60 FBGA 10.0 12.5 Actual Size W3E32M64S-XSBX DENSITY COMPARISONS Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. The DDR SDRAM provides for programmable READ or WRITE burst lengths of 2, 4, or 8 locations. An auto precharge function may be enabled to provide a self- timed row precharge that is initiated at the end of the burst access. The pipelined, multibank architecture of DDR SDRAMs allows for concurrent operation, thereby providing high effective bandwidth by hiding row precharge and activation time. An auto refresh mode is provided, along with a power- saving power-down mode. FUNCTIONAL DESCRIPTION Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0-12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SDRAM must be initial- ized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation. 13 22 |
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