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W3E32M72SR-250SBM Datasheet(PDF) 2 Page - White Electronic Designs Corporation |
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W3E32M72SR-250SBM Datasheet(HTML) 2 Page - White Electronic Designs Corporation |
2 / 19 page W3E32M72SR-XSBX 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs July 2006 Rev. 3 White Electronic Designs Corp. reserves the right to change products or specifications without notice. DENSITY COMPARISONS Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. The DDR SDRAM provides for programmable READ or WRITE burst lengths of 2, 4, or 8 locations. An auto precharge function may be enabled to provide a self- timed row precharge that is initiated at the end of the burst access. The pipelined, multibank architecture of DDR SDRAMs allows for concurrent operation, thereby providing high effective bandwidth by hiding row precharge and activation time. An auto refresh mode is provided, along with a power- saving power-down mode. All inputs are compatible with the Jedec Standard for SSTL_2. All full drive options outputs are SSTL_2, Class II compatible. FUNCTIONAL DESCRIPTION Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0-12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation. INITIALIZATION DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Power must first be applied to VCC and VCCQ simultaneously, and then to VREF (and to the system VTT). VTT must be 16 25 66 TSOP 66 TSOP 66 TSOP 66 TSOP 66 TSOP 11.9 11.9 11.9 22.3 Monolithic Solution Actual Size S A V I N G S Area I/O Count 5 x 265mm2 + 2 x 105mm2 = 1536mm2 5 x 66 pins + 2 x 48 = 426 pins 400mm2 74% 208 Balls 51% W3E32M72SR-XSBX White Electronic Designs 48 TSOP 12.6 48 TSOP 12.6 8.3 11.9 22.3 22.3 |
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