WED2ZL64512S

October 2001

Rev. 0

9

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

PACKAGE DIMENSION: 119 BUMP PBGA

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

1.90 (0.075)

MAX

0.711 (0.028)

MAX

1.27 (0.050)

TYP

1.27 (0.050) TYP

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

17.00 (0.669) TYP

CORNER

20.32 (0.800)

TYP

23.00 (0.905)

TYP

7.62 (0.300)

TYP

ORDERING INFORMATION

Part Number

Configuration

(ns)

Clock

(MHz)

WED2ZL64512S35BC

512K x 64

3.5

166

WED2ZL64512S38BC

512K x 64

3.8

150

WED2ZL64512S42BC

512K x 64

4.2

133

WED2ZL64512S50BC

512K x 64

5.0

100

NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.

COMMERCIAL TEMP RANGE (0°C TA  70°C)