WED3C7410E16M450BC datasheet(1/13 Pages) WEDC

Part #	WED3C7410E16M450BC

Description	RISC Microprocessor Multichip Package

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Manufacturer	WEDC [White Electronic Designs Corporation]

Direct Link	http://www.whiteedc.com

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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

WED3C7410E16M-XBX

May 2006

Rev. 9

FEATURES

Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

Implementation of Altivec

™ technology instruction

set

Optional, high-bandwidth MPX bus interface

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted

for high performance, space sensitive, low power systems

and supports the following power management features:

doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBX multichip package consists

of:

7410E AltiVec

™ RISC processor

Dedicated 2MB SSRAM L2 cache, conﬁgured as

256Kx72

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

Maximum Core frequency = 400, 450MHz

Maximum L2 Cache frequency = 200MHz

Maximum 60x Bus frequency = 133MHz**

The WED3C7410E16M-XBX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and military

(-55°C to +125°C) temperature ranges and is well suited

for embedded applications such as missiles, aerospace,

ﬂight computers, ﬁre control systems and rugged critical

systems.

* This product is subject to change without notice.

** At a maximum 60x bus frequency of 133MHz, the maximum

conﬁgurable core frequency is 400MHz.

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

AltiVec

™ is a trademark of Motorola Inc.

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