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WEDPN4M72V-100B2M Datasheet(PDF) 10 Page - White Electronic Designs Corporation |
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WEDPN4M72V-100B2M Datasheet(HTML) 10 Page - White Electronic Designs Corporation |
10 / 15 page 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WEDPN4M72V-XB2X January 2005 Rev. 2 White Electronic Designs Corp. reserves the right to change products or specifications without notice. DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (NOTES 1, 6) VCC = +3.3V ± 0.3V; -55°C ≤ TA ≤ +125°C Parameter/Condition Symbol Min Max Units Supply Voltage VCC 3 3.6 V Input High Voltage: Logic 1; All inputs (21) VIH 2VCC + 0.3 V Input Low Voltage: Logic 0; All inputs (21) VIL -0.3 0.8 V Input Leakage Current: Any input 0V ≤ VIN ≤ VCC (All other pins not under test = 0V) II -5 5 µA Input Leakage Address Current (All other pins not under test = 0V) II -25 25 µA Output Leakage Current: I/Os are disabled; 0V ≤ VOUT ≤ VCCQ IOZ -5 5 µA Output Levels: Output High Voltage (IOUT = -4mA) Output Low Voltage (IOUT = 4mA) VOH 2.4 – V VOL – 0.4 V ICC SPECIFICATIONS AND CONDITIONS (NOTES 1, 6, 11, 13) VCC = +3.3V ± 0.3V; -55°C ≤ TA ≤ +125°C Parameter/Condition Symbol Max Units Operating Current: Active Mode; Burst = 2; Read or Write; tRC = tRC (min); CAS latency = 3 (3, 18, 19) ICC1 575 mA Standby Current: Active Mode; CKE = HIGH; CS# = HIGH; All banks active after tRCD met; No accesses in progress (3, 12, 19) ICC3 225 mA Operating Current: Burst Mode; Continuous burst; Read or Write; All banks active; CAS latency = 3 (3, 18, 19) ICC4 700 mA Self Refresh Current: CKE 0.2V Commercial and Industrial temperature only (27) ICC7 5mA ABSOLUTE MAXIMUM RATINGS Parameter Unit Voltage on VCC Supply relative to VSS -1 to 4.6 V Voltage on NC or I/O pins relative to VSS -1 to 4.6 V Operating Temperature TA (Mil) -55 to +125 °C Operating Temperature TA (Ind) -40 to +85 °C Storage Temperature, Plastic -55 to +125 °C NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. CAPACITANCE (NOTE 2) Parameter Symbol Max Unit Input Capacitance: CK CI1 6 pF Addresses, BA0-1 Input Capacitance CA 20 pF Input Capacitance: All other input-only pins CI2 7 pF Input/Output Capacitance: I/Os CIO 8 pF THERMAL RESISTANCE Description Symbol Max Unit Thermal Resistance: Die Junction to Ambient θJA 17.5 °C/W Thermal Resistance: Die Junction to Ball θJB 12.3 °C/W Thermal Resistance: Die Junction to Case θJC 8.6 °C/W NOTE: Refer to Application Note “PBGA Thermal Resistance Corrleation” for further information regarding WEDC’s thermal modeling. |
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