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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

WEDPN4M72V-XB2X

January 2005

Rev. 2

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (NOTES 1, 6)

Parameter/Condition

Symbol

Min

Max

Units

Supply Voltage

3

3.6

V

Input High Voltage: Logic 1; All inputs (21)

V

Input Low Voltage: Logic 0; All inputs (21)

-0.3

0.8

V

-5

5

µA

Input Leakage Address Current (All other pins not under test = 0V)

-25

25

µA

Output Leakage Current: I/Os are disabled; 0V

-5

5

µA

Output Levels:

2.4

–

V

–

0.4

V

ICC SPECIFICATIONS AND CONDITIONS (NOTES 1, 6, 11, 13)

Parameter/Condition

Symbol

Max

Units

Operating Current: Active Mode;

575

mA

Standby Current: Active Mode; CKE = HIGH; CS# = HIGH;

225

mA

Operating Current: Burst Mode; Continuous burst;

Read or Write; All banks active; CAS latency = 3 (3, 18, 19)

700

mA

Self Refresh Current: CKE 0.2V Commercial and Industrial temperature only (27)

5mA

ABSOLUTE MAXIMUM RATINGS

Parameter

Unit

-1 to 4.6

V

-1 to 4.6

V

Operating Temperature TA (Mil)

-55 to +125

°C

Operating Temperature TA (Ind)

-40 to +85

°C

Storage Temperature, Plastic

-55 to +125

°C

NOTE:

Stress greater than those listed under "Absolute Maximum Ratings" may cause

permanent damage to the device. This is a stress rating only and functional operation

of the device at these or any other conditions greater than those indicated in the

operational sections of this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect reliability.

CAPACITANCE (NOTE 2)

Parameter

Symbol

Max

Unit

Input Capacitance: CK

CI1

6

pF

Addresses, BA0-1 Input Capacitance

CA

20

pF

Input Capacitance: All other input-only pins

CI2

7

pF

Input/Output Capacitance: I/Os

8

pF

THERMAL RESISTANCE

Description

Symbol

Max

Unit

Thermal Resistance: Die Junction to Ambient

θJA

17.5

°C/W

Thermal Resistance: Die Junction to Ball

θJB

12.3

°C/W

Thermal Resistance: Die Junction to Case

θJC

8.6

°C/W

NOTE: Refer to Application Note “PBGA Thermal Resistance Corrleation” for further

information regarding WEDC’s thermal modeling.