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WS128K32-XG2TXE Datasheet(PDF) 1 Page - White Electronic Designs Corporation |
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WS128K32-XG2TXE Datasheet(HTML) 1 Page - White Electronic Designs Corporation |
1 / 6 page 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WS128K32-XG2TXE December 2000 Rev. 0 ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT TTL Compatible Inputs and Outputs Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight WS128K32-XG2TXE – 8 grams typical Radiation tolerant with epitaxial layer on die. 6T memory cells provide excellent protection against soft errors * This product is under development, is not qualified or characterized and is subject to change or cancellation without notice. FEATURES Access Times of 35, 45, 55ns Packaging • 68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"), (Package 509) Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8 Low Power Data Retention Commercial, Industrial and Military Temperature Ranges 5V Power Supply Low Power CMOS Pin Description I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE1-4# Write Enables CS1-4# Chip Selects OE# Output Enable VCC Power Supply GND Ground NC Not Connected Block Diagram Top View FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XG2TXE WE1#CS1#CS2#CS3#CS4# WE4# WE3# WE2# 128K x 8 128K x 8 128K x 8 128K x 8 OE# A0-16 I/O0-7 I/O24-31 I/O16-23 I/O8-15 88 8 8 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 The White 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. |
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