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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

WSF2816-39XX

May 2003

Rev. 6

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

FEATURES

Access Times of 35ns (SRAM) and 90ns (FLASH)

Packaging

• 66 pin, PGA Type, 1.075" square HIP, Hermetic

Ceramic HIP (Package 400)

• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")

square (Package 510) 3.56mm (0.140") height.

Designed to fit JEDEC 68 lead 0.990” CQFJ

footprint (FIGURE 2)

128Kx16 SRAM

512Kx16 5V FLASH

Organized as 128Kx16 of SRAM and 512Kx16 of

Flash Memory with separate Data Buses

Both blocks of memory are User Configurable as

256Kx8

Low Power CMOS

Commercial, Industrial and Military Temperature

Ranges

TTL Compatible Inputs and Outputs

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight:

WSF2816-39G2UX - 8 grams typical

WSF2816-39H1X - 13 grams typical

FLASH MEMORY FEATURES

100,000 Erase/Program Cycles

Sector Architecture

• 8 equal size sectors of 64K bytes each

• Any combination of sectors can be concurrently

erased. Also supports full chip erase

5 Volt Programming; 5V ± 10% Supply

Embedded Erase and Program Algorithms

Hardware Write Protection

Note: For programming information refer to Flash Programming 4M5 Application Note.

128K x 8

SRAM

128K x 8

SRAM

512K x 8

FLASH

512K x 8

FLASH

8

SWE

S CS

SWE

S CS

FWE

F CS

FWE

F CS

8

8

8

OE#

Block Diagram

Pin Description

Flash Data Inputs/Outputs

SRAM Data Inputs/Outputs

Address Inputs

SRAM Write Enable

SRAM Chip Selects

OE#

Output Enable

Power Supply

GND

Ground

NC

Not Connected

Flash Write Enable

Flash Chip Select

GND

NC

OE#

NC

GND

11

22

33

44

55

66

1

12

23

34

45

56

FIGURE1 – PIN CONFIGURATION

FOR WSF2816-39H1X

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