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WD512K32NV-17H1CA Datasheet(PDF) 6 Page - White Electronic Designs Corporation

Part # WD512K32NV-17H1CA
Description  512Kx32 SRAM 3.3V MULTICHIP PACKAGE
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Manufacturer  WEDC [White Electronic Designs Corporation]
Direct Link  http://www.whiteedc.com
Logo WEDC - White Electronic Designs Corporation

WD512K32NV-17H1CA Datasheet(HTML) 6 Page - White Electronic Designs Corporation

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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WS512K32V-XXX
March
2006
Rev. 12
27.3 (1.075) ± 0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
1.27 (0.050) TYP DIA
25.4 (1.0) TYP
15.24 (0.600) TYP
2.54 (0.100)
TYP
3.81 (0.150)
± 0.13 (0.005)
4.60 (0.181)
MAX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) ± 0.05 (0.002)
0.25 (0.010) ± 0.10 (0.002)
25.15 (0.990) ± 0.25 (0.010) SQ
1.27 (0.050) TYP
24.0 (0.946)
± 0.25 (0.010)
22.36 (0.880) ± 0.25 (0.010) SQ
20.3 (0.800) REF
23.87
(0.940) REF
1.01 (0.040)
± 0.13 (0.005)
0.25 (0.010) REF
1° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
0.53 (0.021)
± 0.18 (0.007)
3.51 (0.140) MAX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES


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