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MC100ES60T22D Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

Part No. MC100ES60T22D
Description  3.3 V Dual LVTTL/LVCMOS to Differential LVPECL Translator
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Maker  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
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 5 page
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Advanced Clock Drivers Devices
Freescale Semiconductor
5
MC100ES60T22
PACKAGE DIMENSIONS
TSSOP-8
DT SUFFIX
8-LEAD TSSOP PACKAGE
CASE 1640-01
ISSUE O
A
B
3.00
1
2
8
1.95
0.60
0.60
1.5
0.65
0.325
8
3
8
3
0.20 C
0.25 C
0.20 C D
2X
4.90
2.45
1.5
3.00
D
2X
0.38
0.25
8X
0.13 M
A-B
CD
1.10 MAX
DETAIL "B"
SEATING PLANE
GAUGE PLANE
TOP VIEW
0.95
0.75
0.15
0.05
0.10 C
8X
4X
C
0.48 MAX
(0.95)
0.07 MIN
0.70
0.40
15˚
4X
15˚
0.38
0.25
0.33
0.25
0.23
0.13
0.18
0.13
BASE METAL
A
A
SEE VIEW C
H
B
B
0.25
4
SEATING PLANE
C
SIDE VIEW
VIEW A-A
DETAIL "B"
DAMBAR PROTRUSION
SECTION B-B
SEE NOTE 6
VIEW C
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
DIMENSIONS ARE IN MILLIMETERS.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS
AND ARE MEASURED AT DATUM H, MOLD FLASH OR PROTRUSIONS,
SHALL NOT EXCEED 0.15mm PER SIDE.
DIMENSION IS THE LENGTH OF TERMINAL FOR SOLDERING TO A
SUBSTRATE.
THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS
OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD
FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.14mm SEE DETAIL "B" AND SECTION B-B.
SECTION B-B TO BE DETERMINED AT 0.10 TO 0.25mm FROM THE LEAD TIP.
THIS PART IS COMPLIANT WITH JEDEC REGISTRATION MO-187 AA.
DATUMS A AND B TO BE DETERMINED DATUM PLANE H.




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