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TPS79530DCQR Datasheet(PDF) 11 Page - Texas Instruments

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Part # TPS79530DCQR
Description  ULTRALOW-NOISE, HIGH PSRR, FAST RF 500-mA LOW-DROPOUT LINEAR REGULATORS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS79530DCQR Datasheet(HTML) 11 Page - Texas Instruments

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THERMAL INFORMATION
TJ
A
RθJC
TC
B
RθCS
TA
C
RθSA
(a)
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
T
J
+ TA ) PD max
RθJC ) RθCS ) RθSA
(5)
P
D max
+ VIN(avg) * VOUT(avg)
I
OUT(avg)
) VI(avg)
I
(Q)
TPS79501, TPS79516
TPS79518, TPS79525
TPS79530, TPS79533
SLVS350C – OCTOBER 2002 – REVISED JANUARY 2005
The amount of heat that an LDO linear regulator
generates is directly proportional to the amount of
power it dissipates during operation. All integrated
circuits have a maximum allowable junction tempera-
ture (TJ(max)) above which normal operation is not
assured.
A
system
designer
must
design
the
operating environment so that the operating junction
temperature (TJ) does not exceed the maximum
junction temperature (TJ(max)). The two main environ-
mental variables that a designer can use to improve
thermal performance are air flow and external
heatsinks. The purpose of this information is to aid
the designer in determining the proper operating
environment for a linear regulator that is operating at
a specific power level.
Figure 25. Thermal Resistances
In general, the maximum expected power (PD(max))
consumed by a linear regulator is computed as
Equation 5 summarizes the computation:
Equation 4:
The RΘJC is specific to each regulator as determined
(4)
by its package, lead frame, and die size provided in
where:
the regulator's data sheet. The RΘSA is a function of
the type and size of heatsink. For example, black
VIN(avg) is the average input voltage
body radiator type heatsinks can have RΘCS values
VOUT(avg) is the average output voltage
ranging from 5
°C/W for very large heatsinks to
IOUT(avg) is the average output current
50
°C/W for very small heatsinks. The RΘ
CS
is a
I(Q) is the quiescent current
function of how the package is attached to the
heatsink. For example, if a thermal compound is used
For most TI LDO regulators, the quiescent current is
to attach a heatsink to a SOT223 package, RΘCS of
insignificant compared to the average output current;
1
°C/W is reasonable.
therefore, the term VIN(avg) x I(Q) can be neglected.
The operating junction temperature is computed by
Even if no external black body radiator type heatsink
adding the ambient temperature (TA) and the in-
is attached to the package, the board on which the
crease in temperature due to the regulator's power
regulator is mounted provides some heatsinking
dissipation. The temperature rise is computed by
through the pin solder connections. Some packages,
multiplying the maximum expected power dissipation
like the DDPAK and SOT223 packages, use a copper
by the sum of the thermal resistances between the
plane underneath the package or the circuit board's
junction and the case (RΘJC), the case to heatsink
ground plane for additional heatsinking to improve
(RΘCS), and the heatsink to ambient (RΘSA). Thermal
their thermal performance. Computer aided thermal
resistances are measures of how effectively an object
modeling can be used to compute very accurate
dissipates heat. Typically, the larger the device, the
approximations of an integrated circuit's thermal per-
more surface area available for power dissipation and
formance in different operating environments (e.g.,
the lower the object's thermal resistance.
different types of circuit boards, different types and
sizes of heatsinks, and different air flows, etc.). Using
Figure 25 illustrates these thermal resistances for (a)
these models, the three thermal resistances can be
a SOT223 package mounted in a JEDEC low-K
combined into one thermal resistance between junc-
board.
tion and ambient (RΘJA). This RΘJA is valid only for the
specific operating environment used in the computer
model.
11


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