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M6MGB160S4BVP Datasheet(PDF) 10 Page - Mitsubishi Electric Semiconductor |
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M6MGB160S4BVP Datasheet(HTML) 10 Page - Mitsubishi Electric Semiconductor |
10 / 30 page MITSUBISHI LSIs Sep. 1999 , Rev.2.0 16,777,216-BIT (1,048,576 -WORD BY 16-BIT / 2,097,152-WORD BY 8-BIT) CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (262,144WORD BY 16-BIT / 524,288-WORD BY 8-BIT) CMOS SRAM Stacked-MCP (Multi Chip Package) M6MGB/T160S4BVP 10 DEVICE IDENTIFIER CODE In the word-wide mode, the upper data(D15-8) is "0". Code Manufacturer Code Pins Hex. Data 1CH DQ0 0 A0 VIL DQ1 0 DQ2 1 DQ3 1 DQ4 1 DQ5 DQ6 0 DQ7 0 Device Code (-T160S4BVP) A0H VIH 00 1 Device Code (-B160S4BVP) VIH 10 0 1 1 0 0 0 0 0 0 0 A1H 0 1 CAPACITANCE Symbol Parameter Test conditions pF pF Unit Max 8 12 Typ Min Limits Ta = 25 °C, f = 1MHz, Vin = Vout = 0V Input capacitance (Address, Control Pins) Output capacitance CIN COUT 1) Minimum DC voltage is -0.5V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <20ns. Maximum DC voltage on input/output pins is F-VCC+0.5V which, during transitions, may overshoot to F-VCC+1.5V for periods <20ns. ABSOLUTE MAXIMUM RATINGS Conditions Parameter With respect to Ground Symbol F-Vcc All input or output voltage VI1 Flash Vcc voltage 1) Unit V V Min Max 4.6 -0.2 Ambient temperature Temperature under bias Ta Tbs Storage temperature Tstg °C °C °C 85 -50 95 -65 125 Output short circuit current I OUT mA 100 -0.6 4.6 -20 Note: The value of common pins to Flash Memory is the sum of Flash Memory and SRAM. All currents are in RMS unless otherwise noted. 1) Typical values at F-Vcc=3.3V, Ta=25 °C 2) To protect against initiation of write cycle during Vcc power-up/ down, a write cycle is locked out for Vcc less than VLKO. If Vcc is less than VLKO, Write State Machine is reset to read mode. When the Write State Machine is in Busy state, if Vcc is less than VLKO, the alteration of memory contents may occur. DC ELECTRICAL CHARACTERISTICS (Ta = -20~ 85 °C, F-Vcc = 2.7V ~ 3.6V, unless otherwise noted) Symbol Parameter Max Typ1) Limits Min Test conditions Unit F-VCC standby current ILO ±11 Output leakage current mA 0V £VOUT£F-VCC ILI Input leakage current mA 0V £VIN£F-VCC ±2.0 F-VCC deep powerdown current ICC3 F-VCC program current mA 35 F-VCC = 3.6V, VIN=VIL/VIH, F-CE# = F-RP# =F-WP# = VIH ICC4 F-VCC erase current mA 35 F-VCC = 3.6V, VIN=VIL/VIH, F-CE# = F-RP# =F-WP# = VIH Output high voltage V VOL Output low voltage V IOL = 4.0mA 0.45 F-Vcc+0.5 VIH Input high voltage V 2.0 0.8 VIL Input low voltage – 0.5 VOH1 IOH = –2.0mA 0.85(F-Vcc) V VOH2 IOH = –100 mA F-Vcc–0.4 V VLKO Low VCC Lock-Out voltage 2) 1.5 2.2 V ICC5 F-VCC suspend current 200 F-VCC = 3.6V, VIN=VIL/VIH, F-CE# = F-RP# =F-WP# = VIH mA ISB2 5 F-VCC = 3.6V, VIN=GND or F-VCC, F-CE# = F-RP# = F-WP# = F-VCC ±0.3V mA 0.1 15 mA ICC1 F-VCC read current for Word or Byte F-VCC = 3.6V, VIN=VIL/VIH, F-CE# = VIL, F-RP#=OE#=VIH, IOUT = 0mA 8 ISB1 F-VCC = 3.6V, VIN=VIL/VIH, F-CE# = F-RP# =F-WP# = VIH mA 200 50 ICC2 15 mA F-VCC Write current for Word or Byte F-VCC = 3.6V,VIN=VIL/VIH, F-CE# =WE#= VIL, F-RP#=OE#=VIH F-VCC = 3.6V, VIN=VIL/VIH, F-RP# = VIL mA 15 5 ISB3 mA 0.1 ISB4 F-VCC = 3.6V, VIN=GND or VCC, F-RP# =GND ±0.3V 5 5MHz 4 2 1MHz |
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