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93AA86A Datasheet(PDF) 21 Page - Microchip Technology

Part # 93AA86A
Description  16K Microwire Compatible Serial EEPROM
Download  28 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

93AA86A Datasheet(HTML) 21 Page - Microchip Technology

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© 2005 Microchip Technology Inc.
DS21797G-page 21
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
PAD
METAL
D2
BOTTOM VIEW
2
1
bp
n
(NOTE 3)
EXPOSED
TIE BAR
PIN 1
(NOTE 1)
ID INDEX
AREA
(NOTE 2)
CONFIGURATION
CONTACT
ALTERNATE
DETAIL
K
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent MO-229 VCED-2
See ASME Y14.5M
See ASME Y14.5M
MILLIMETERS*
0.50 BSC
2.00 BSC
0.20 REF.
3.00 BSC
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
.039
.035
.031
0.80
A
Overall Height
2. Exposed pad may vary according to die attach paddle size.
* Controlling Parameter
Contact Length §
Notes:
Contact Width
Standoff
Overall Width
Overall Length
Contact Thickness
Exposed Pad Width
Exposed Pad Length
.010
.008
L
b.012
0.20
.001
.008 REF.
.079 BSC
.118 BSC
D
.051
.059
D2
E2
E
.000
A3
A1
.069
.075
1.30**
1.50**
.002
0.00
Dimension Limits
Pitch
Number of Pins
INCHES
.020 BSC
MIN
n
e
NOM
Units
8
MAX
MIN
1.00
0.90
0.25
0.30
1.75
1.90
0.02
0.05
8
NOM
MAX
Contact-to-Exposed Pad
§
.012
K
.016
0.40
.020
0.30
0.50
** Not within JEDEC parameters
§ Significant Characteristic
.008
0.20
DWG No. C04-123
Revised 09-12-05


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