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HP1-TO66-8B Datasheet(PDF) 3 Page - CTS Corporation |
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HP1-TO66-8B Datasheet(HTML) 3 Page - CTS Corporation |
3 / 7 page HP1 Series for Dual TO-66 Outline DESCRIPTION OF CURVES C. N.C. Horiz. Device Only Mounted to G-10. G. N.C. Horiz. & Vert. With Dissipator. H. 200 RPM w/Diss. I. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 2.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2 °C at equivalent power levels. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) Max. Weight (Grams) HP1-TO66-4U HP1-TO66-36U HP1-TO66-4CB HP1-TO66-36CB HP1-TO66-4B HP1-TO66-36B Two TO-66s Two TO-66 Ics 32 34 35.0 35.0 |
Similar Part No. - HP1-TO66-8B |
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Similar Description - HP1-TO66-8B |
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