NOVEMBER 1997 - REVISED FEBRUARY 2005

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

MECHANICAL DATA

TISP3600F3, TISP3700F3

SL003 3-pin Plastic Single-In-Line Package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will

withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high

humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

SL003

2

1

3

NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position.

B. Body molding flash of up to 0.15 (0.006) may occur in the package lead plane.

MDXXCEB

Index

Notch

9.25 - 9.75

(0.364 - 0.384)

3.20 - 3.40

(0.126 - 0.134)

6.10 - 6.60

(0.240- 0.260)

0.203 - 0.356

(0.008- 0.014)

0.559 - 0.711

(0.022 - 0.028)

3 Places

12.9

(0.492)

DIMENSIONS ARE:

MILLIMETERS

(INCHES)

4.267

(0.168)

MIN.

MAX.

1.854

(0.073)

MAX.

8.31

(0.327)

MAX.

2.54

(0.100)

Typical

(See Note A)

2 Places

“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.

“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.