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MPXHZ6130A Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part No. MPXHZ6130A
Description  INTEGRATED PRESSURE SENSOR 15 TO 130 kPa (2.2 TO 18.9 PSI) 0.2 TO 4.8 V OUTPUT
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXHZ6130A Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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MPXHZ6130A
Sensors
6
Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SSOP Footprint (Case 1317 and 1317A)
PACKAGE DIMENSIONS
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE


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