DFN8

CASE 506AL−01

ISSUE A

DATE 20 DEC 2005

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND

0.30mm.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

GENERIC

MARKING DIAGRAM*

XXXX = Specific Device Code

A

= Assembly Location

Y

= Year

WW

= Work Week

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “

G”,

may or may not be present.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

8 X

0.10

B

0.05

A

C

C

K

8 X

NOTE 3

2 X

0.15 C

PIN ONE

REFERENCE

TOP VIEW

2 X

0.15 C

8 X

A

A1

(A3)

0.08 C

0.10 C

C

SEATING

PLANE

SIDE VIEW

L

8 X

14

5

8

XXXX

AYWW

1

1

8

2 X

D2

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.80

0.90

1.00

A1

0.00

0.03

0.05

A3

0.20 REF

b

0.35

0.40

0.45

D

3.30 BSC

D2

0.95

1.05

1.15

E

3.30 BSC

E2

1.80

1.90

2.00

e

0.80 BSC

K

0.21

−−−

−−−

L

0.30

0.40

0.50

STYLE 1:

PIN 1. IN

2. GND

3. CNTRL

4. DRAIN

5. SOURCE

6. GATE

7. OUT

8. VCC

2X

0.60

2.95

1.95

0.55

1

2X

0.45

0.80

PITCH

3.60

1.20

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X

DIMENSIONS: MILLIMETERS

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON20636D

ON SEMICONDUCTOR STANDARD

DFN8, 3.3X3.3 MM, 0.8 MM PITCH, DUAL FLAG

Electronic

versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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