Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

Page 4 of 4

April 2006

AH116

½ Watt, High Linearity InGaP HBT Amplifier

Product Information

AH116-S8G (Lead-Free Package) Mechanical Information

This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260

qC reflow temperature) and lead (maximum 245 qC reflow temperature) soldering processes.

Outline Drawing

Mounting Configuration / Land Pattern

Thermal Specifications

Parameter

Rating

-40 to +85

qC

62

qC / W

162

qC

Notes:

1. The amplifier can be operated at 105 C case temperature for up to 1000

hours over its lifetime without degradation in performance and will not

degrade device operation at the recommended maximum 85 C case

temperature for the rest of its lifetime.

2. The thermal resistance is referenced from the junction-to-case at a case

temperature of 85 C. Tjc is a function of the voltage at pins 6 and 7 and

the current applied to pins 6, 7, and 8 and can be calculated by:

Tjc = Tcase + Rth * Vcc * Icc

3. This corresponds to the typical biasing condition of +5V, 250 mA at an

85 C case temperature. A minimum MTTF of 1 million hours is achieved

for junction temperatures below 247 C.

Product Marking

The component will be marked with an

“AH116G” designator with an alphanumeric lot

code on the top surface of the package.

The

obsolete tin-lead package is marked with an

“AH116-S8”

or

“ECP052G”

designator

followed by an alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes

500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 2 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

MTTF vs. GND Tab Temperature

100

1000

10000

100000

60

70

80

90

100

110

120

Tab Temperature (°C)