2000 Apr 26

4

Philips Semiconductors

Objective specification

Hybrid CATV amplifier module

BGR69

PACKAGE OUTLINE

UNIT

A2

max.

c

ee1

q

Q

max.

q1

q2

U1

max.

U2

W

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

20.8

9.1

0.51

0.38

0.25 27.2 2.54 13.75 2.54 5.08 12.7

8.8

4.15

3.85

2.4

38.1 25.4 10.2

4.2 44.75

8

0.25

0.1

3.8

bF

p

6-32

UNC

y

w

S

DIMENSIONS (mm are the original dimensions)

SOT115J

0

5

10 mm

scale

A

max.

D

max.

L

min.

E

max.

Z

max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;

2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D

U1

q

q2

q1

b

F

S

A

Z

p

E

A2

L

c

d

Q

U2

M

w

78

9

23

W

e

e1

5

p

1

d

max.

B

99-02-06