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BGY282 Datasheet(PDF) 10 Page - NXP Semiconductors |
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BGY282 Datasheet(HTML) 10 Page - NXP Semiconductors |
10 / 12 page 2001 Dec 04 10 Philips Semiconductors Preliminary specification dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 01-09-26 01-11-20 IEC JEDEC EIAJ SOT632A 0 5 10 mm scale Leadless surface mounted package; plastic cap; 12 terminations SOT632A A c E1 D 5 12 4 3 7 6 12 11 10 8 9 D1 E (4 ×) (4 ×) pin 1 index UNIT mm 1.5 1.4 3.75 3.65 1.8 1.4 2.1 4.0 bb1 DIMENSIONS (mm are the original dimensions) A 14.05 13.45 D 0.61 0.49 c 13.35 13.05 D1 8.3 7.7 Ee 3.275 e1 7.85 7.55 1.45 1.35 E1 e2 L 3.75 3.65 Z 2.45 2.35 Z1 1.55 1.45 ZD 1.55 1.45 Z2 1.35 1.25 Z3 0.75 0.65 Z4 0.7 0.6 Z5 0.625 0.525 Z6 1.55 1.45 Z7 0.75 0.65 Z8 0.85 0.75 Z9 b1 (4×) L (12 ×) ZD (2×) Dimensions of solderresist Dimensions of terminations Z7 (4 ×) e b (8 ×) (2 ×) e1 Z3 (2 ×) Z5 (4×) Z2 (6 ×) e2 Z4 (8 ×) Z8 Z9 Z (2 ×) Z6 (4×) Z1 (4 ×) |
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