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S29GL512N90FFI023 Datasheet(PDF) 4 Page - SPANSION

Part # S29GL512N90FFI023
Description  3.0 Volt-only Page Mode Flash Memory featuring 110 nm MirrorBit??Process Technology
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
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S29GL512N90FFI023 Datasheet(HTML) 4 Page - SPANSION

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S29GL-N MirrorBit™ Flash Family
S29GL-N_00_B3 October 13, 2006
Data
Sheet
General Description
The S29GL512/256/128N family of devices are 3.0V single power flash memory manufac-
tured using 110 nm MirrorBit technology. The S29GL512N is a 512 Mbit, organized as
33,554,432 words or 67,108,864 bytes. The S29GL256N is a 256 Mbit, organized as
16,777,216 words or 33,554,432 bytes. The S29GL128N is a 128 Mbit, organized as
8,388,608 words or 16,777,216 bytes. The devices have a 16-bit wide data bus that can also
function as an 8-bit wide data bus by using the BYTE# input. The device can be programmed
either in the host system or in standard EPROM programmers.
Access times as fast as 90 ns (S29GL128N, S29GL256N), 100 ns (S29GL512N) are available.
Note that each access time has a specific operating voltage range (VCC) and an I/O voltage
range (VIO), as specified in the Product Selector Guide‚ on page 6 and the Ordering Infor-
mation‚ on page 12. The devices are offered in a 56-pin TSOP or 64-ball Fortified BGA
package. Each device has separate chip enable (CE#), write enable (WE#) and output enable
(OE#) controls.
Each device requires only a single 3.0 volt power supply for both read and write functions.
In addition to a VCC input, a high-voltage accelerated program (WP#/ACC) input provides
shorter programming times through increased current. This feature is intended to facilitate
factory throughput during system production, but may also be used in the field if desired.
The devices are entirely command set compatible with the JEDEC single-power-supply
Flash standard. Commands are written to the device using standard microprocessor write
timing. Write cycles also internally latch addresses and data needed for the programming and
erase operations.
The sector erase architecture allows memory sectors to be erased and reprogrammed
without affecting the data contents of other sectors. The device is fully erased when shipped
from the factory.
Device programming and erasure are initiated through command sequences. Once a program
or erase operation has begun, the host system need only poll the DQ7 (Data# Polling) or DQ6
(toggle) status bits or monitor the Ready/Busy# (RY/BY#) output to determine whether
the operation is complete. To facilitate programming, an Unlock Bypass mode reduces com-
mand sequence overhead by requiring only two write cycles to program data instead of four.
The Enhanced VersatileI/O™ (VIO) control allows the host system to set the voltage levels
that the device generates and tolerates on all input levels (address, chip control, and DQ input
levels) to the same voltage level that is asserted on the VIO pin. This allows the device to
operate in a 1.8 V or 3 V system environment as required.
Hardware data protection measures include a low VCC detector that automatically inhibits
write operations during power transitions. Persistent Sector Protection provides in-sys-
tem, command-enabled protection of any combination of sectors using a single power supply
at VCC. Password Sector Protection prevents unauthorized write and erase operations in
any combination of sectors through a user-defined 64-bit password.
The Erase Suspend/Erase Resume feature allows the host system to pause an erase op-
eration in a given sector to read or program any other sector and then complete the erase
operation. The Program Suspend/Program Resume feature enables the host system to
pause a program operation in a given sector to read any other sector and then complete the
program operation.
The hardware RESET# pin terminates any operation in progress and resets the device,
after which it is then ready for a new operation. The RESET# pin may be tied to the system
reset circuitry. A system reset would thus also reset the device, enabling the host system to
read boot-up firmware from the Flash memory device.


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