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ADG787 Datasheet(PDF) 14 Page - Analog Devices |
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ADG787 Datasheet(HTML) 14 Page - Analog Devices |
14 / 16 page ADG787 Rev. A | Page 14 of 16 OUTLINE DIMENSIONS 3.00 BSC SQ INDEX AREA TOP VIEW 1.50 BCS SQ EXPOSED PAD (BOTTOM VIEW) 1.74 1.64 1.49 2.48 2.38 2.23 1 6 10 0.50 BSC 0.50 0.40 0.30 5 PIN 1 INDICATOR 0.80 0.75 0.70 0.05 MAX 0.02 NOM SEATING PLANE 0.30 0.23 0.18 0.20 REF 0.80 MAX 0.55 TYP SIDE VIEW Figure 38. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very, Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-BA 0.23 0.08 0.80 0.60 0.40 8° 0° 0.15 0.05 0.33 0.17 0.95 0.85 0.75 SEATING PLANE 1.10 MAX 10 6 5 1 0.50 BSC PIN 1 COPLANARITY 0.10 3.10 3.00 2.90 3.10 3.00 2.90 5.15 4.90 4.65 Figure 39. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters |
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