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DL126TRD Datasheet(PDF) 3 Page - ON Semiconductor |
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DL126TRD Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 8 page DL126TRS/D http://onsemi.com 3 Figure 3 . CARRIER TAPE SPECIFICATIONS P0 K t B1 K0 Top Cover Tape Embossment User Direction of Feed Center Lines of Cavity D P2 10 Pitches Cumulative Tolerance on Tape ± 0.2 mm ( ± 0.008″) E F W P B0 A0 D1 For Components 2.0 mm x 1.2 mm and Larger * Top Cover Tape Thickness (t1) 0.10 mm (.004 ″) Max. Embossment Embossed Carrier R Min Bending Radius Maximum Component Rotation Typical Component Cavity Center Line Typical Component Center Line 100 mm (3.937 ″) 250 mm (9.843 ″) 1 mm (.039 ″) Max 1 mm Max 10° Tape and Components Shall Pass Around Radius “R” Without Damage Tape For Machine Reference Only Including Draft and RADII Concentric Around B0 Camber (Top View) Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm See Note 1 Bar Code Label Table 2. DIMENSIONS Tape Size B1 Max D D1 E F K P0 P2 R Min T Max W Max 8mm 4.55mm (.179″) 1.5+0.1mm -0.0 1.0Min (.039″) 1.75±0.1mm (.069±.004″) 3.5±0.05mm (.138±.002″) 2.4mmMax (.094″) 4.0±0.1mm (.157±.004″) 2.0±0.1mm (.079±.002″) 25mm (.98″) 0.6mm (.024″) 8.3mm (.327″) 12mm 8.2mm (.323″) 0.0 (.059+.004″ -0.0) 1.5mmMin (.060″) (.069±.004 ) 5.5±0.05mm (.217±.002″) 6.4mmMax (.252″) (.157±.004 ) (.079±.002 ) 30mm (1.18″) (.024 ) 12±.30mm (.470±.012″) 16mm 12.1mm (.476″) (.060 ) 7.5±0.10mm (.295±.004″) 7.9mmMax (.311″) (1.18 ) 16.3mm (.642″) 24mm 20.1mm (.791″) 11.5±0.1mm (.453±.004″) 11.9mmMax (.468″) 24.3mm (.957″) Metric dimensions govern — English are in parentheses for reference only. 1. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.50 mm max., the component cannot rotate more than 10 ° within the determined cavity. 2. If B1 exceeds 4.2 mm (0.165) for 8 mm embossed tape, the tape may not feed through all tape feeders. 3. Pitch information is contained in Table 1. Embossed Tape and Reel Ordering Information on pg. 1. |
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