ADM3232E

Rev. 0 | Page 9 of 12

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AC

10.00 (0.3937)

9.80 (0.3858)

16

9

8

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COPLANARITY

0.10

8°

0°

45°

Figure 13. 16-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(RN-16)

Dimensions shown in millimeters (and inches)

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 14. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADM3232EARNZ1

–40°C to +85°C

16-Lead SOIC_N

RN-16

ADM3232EARNZ-REEL71

–40°C to +85°C

16-Lead SOIC_N

RN-16

ADM3232EARUZ1

–40°C to +85°C

16-Lead TSSOP

RU-16

ADM3232EARUZ-REEL71

–40°C to +85°C

16-Lead TSSOP

RU-16