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ADP1711AUJZ-1.0-R7 Datasheet(PDF) 11 Page - Analog Devices |
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ADP1711AUJZ-1.0-R7 Datasheet(HTML) 11 Page - Analog Devices |
11 / 16 page ADP1710/ADP1711 Rev. 0 | Page 11 of 16 Current and thermal limit protections are intended to protect the device against accidental overload conditions. For reliable operation, device power dissipation must be externally limited so junction temperatures do not exceed 125°C. THERMAL CONSIDERATIONS To guarantee reliable operation, the junction temperature of the ADP1710/ADP1711 must not exceed 125°C. To ensure the junction temperature stays below this maximum value, the user needs to be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θJA). The θJA number is dependent on the package assembly compounds used and the amount of copper to which the GND pins of the package are soldered on the PCB. Table 5 shows typical θJA values of the 5lead TSOT package for various PCB copper sizes. Table 5. Copper Size (mm2) θJA (°C/W) 01 170 50 152 100 146 300 134 500 131 1 Device soldered to minimum size pin traces. The junction temperature of the ADP1710/ADP1711 can be calculated from the following equation: TJ = TA + (PD × θJA) (2) where: TA is the ambient temperature. PD is the power dissipation in the die, given by PD = [(VIN – VOUT) × ILOAD] + (VIN × IGND) (3) where: ILOAD is the load current. IGND is the ground current. VIN and VOUT are the input voltage and output voltage, respectively. Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following: TJ = TA + {[(VIN – VOUT) × ILOAD] × θJA} (4) As shown in Equation 4, for a given ambient temperature, input to output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure the junction temperature does not rise above 125°C. The following figures show junction temperature calculations for different ambient temperatures, load currents, VIN to VOUT differentials, and areas of PCB copper. 140 0 0.5 5.0 VIN – VOUT (V) 120 100 80 60 40 20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1mA 10mA 30mA 80mA 100mA 125mA 150mA (LOAD CURRENT) MAX TJ (DO NOT OPERATE ABOVE THIS POINT) Figure 23. 500 mm2 of PCB Copper, TA = 25°C 140 0 0.5 5.0 VIN – VOUT (V) 120 100 80 60 40 20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1mA 10mA 30mA 80mA 100mA 125mA 150mA (LOAD CURRENT) MAX TJ (DO NOT OPERATE ABOVE THIS POINT) Figure 24. 100 mm2 of PCB Copper, TA = 25°C 140 0 0.5 5.0 VIN – VOUT (V) 120 100 80 60 40 20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1mA 10mA 30mA 80mA 100mA 125mA 150mA (LOAD CURRENT) MAX TJ (DO NOT OPERATE ABOVE THIS POINT) Figure 25. 0 mm2 of PCB Copper, TA = 25°C |
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