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NUD4001 Datasheet(PDF) 1 Page - ON Semiconductor

Part # NUD4001
Description  High Current LED Driver
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NUD4001 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
1
Publication Order Number:
NUD4001/D
NUD4001
High Current LED Driver
This device is designed to replace discrete solutions for driving
LEDs in low voltage AC−DC applications 5.0 V, 12 V or 24 V. An
external resistor allows the circuit designer to set the drive current for
different LED arrays. This discrete integration technology eliminates
individual components by combining them into a single package,
which results in a significant reduction of both system cost and board
space. The device is a small surface mount package (SO–8).
Features
Supplies Constant LED Current for Varying Input Voltages
External Resistor Allows Designer to Set Current – up to 500 mA
Offered in Surface Mount Package Technology (SO−8)
Pb−Free Package is Available
Benefits
Maintains a Constant Light Output During Battery Drain
One Device can be used for Many Different LED Products
Reduces Board Space and Component Count
Simplifies Circuit and System Designs
Typical Applications
Portables: For Battery Back−up Applications, also Simple Ni−CAD
Battery Charging
Industrial: Low Voltage Lighting Applications and Small Appliances
Automotive: Tail Lights, Directional Lights, Back−up Light,
Dome Light
PIN FUNCTION DESCRIPTION
Pin
Symbol
Description
1
Vin
Positive input voltage to the device
2
Boost
This pin may be used to drive an external transistor
as described in the App Note AND8198/D.
3
Rext
An external resistor between Rext and Vin pins sets
different current levels for different application needs
4
GND
Ground
5, 6, 7, 8
Iout
The LEDs are connected from these pins to ground
http://onsemi.com
Device
Package
Shipping
ORDERING INFORMATION
NUD4001DR2
SO−8
2500 / Tape & Reel
SO−8
CASE 751
STYLE 25
PIN CONFIGURATION
AND SCHEMATIC
1
8
Rext
GND
Vin
Iout
Iout
Iout
Current
Set Point
4001 = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Device
MARKING
DIAGRAM
Boost
Iout
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
2
3
4
8
7
6
5
NUD4001DR2G
SO−8
(Pb−Free)
2500 / Tape & Reel
4001
AYWW
G
1
8


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