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KMI16-1 Datasheet(PDF) 9 Page - NXP Semiconductors |
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KMI16-1 Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 12 page 2000 Sep 05 9 Philips Semiconductors Product specification Integrated rotational speed sensor KMI16/1 PACKAGE OUTLINE UNIT bp c Q L2 L1 v REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 1.7 1.4 0.8 0.7 bp1 1.57 1.47 5.7 5.5 4.1 3.9 0.3 0.24 1.2 0.9 3.9 3.5 M1 8.15 7.85 M2 8.15 7.85 M3 (1) 4.7 4.3 L 7.55 7.25 D(2) D1 (2) 4.5 4.3 E(2) 5.7 5.5 4.6 4.4 E1 (2) 18.2 17.8 HE 5.6 5.5 HE1 K max. 5.37 e 2.35 2.15 e1 0.25 0.75 0.65 DIMENSIONS (mm are the original dimensions) SOT477B 99-09-23 00-08-31 0 2.5 5 mm scale A(1) Plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads SOT477B e 12 3 e1 E E1 HE1 L1 D L bp1 D1 SENSOR DIE POSITION * centre of reading point HE M1 L2 bp c v M AB Q v M AB A K M2 M3 B A Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. |
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Similar Description - KMI16-1 |
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