AD9461

Rev. 0 | Page 7 of 28

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

ELECTRICAL

AVDD1 to AGND

−0.3 V to +4 V

AVDD2 to AGND

−0.3 V to +6 V

DRVDD to DGND

−0.3 V to +4 V

AGND to DGND

−0.3 V to +0.3 V

AVDD1 to DRVDD

−4 V to +4 V

AVDD2 to DRVDD

−4 V to +6 V

AVDD2 to AVDD

−4 V to +6 V

D0± through D15± to DGND

−0.3 V to DRVDD + 0.3 V

CLK+/CLK− to AGND

–0.3 V to AVDD1 + 0.3 V

OUTPUT MODE, DCS MODE, and

DFS to AGND

–0.3 V to AVDD1 + 0.3 V

VIN+, VIN− to AGND

−0.3 V to AVDD2 + 0.3 V

VREF to AGND

−0.3 V to AVDD1 + 0.3 V

SENSE to AGND

−0.3 V to AVDD1 + 0.3 V

REFT, REFB to AGND

−0.3 V to AVDD1 + 0.3 V

ENVIRONMENTAL

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The heat sink of the AD9461 package must be soldered to

ground.

more metal directly in contact with the package leads from

metal traces through holes, ground, and power planes reduces

the ground plane.

Table 6.

Package Type

Unit

100-Lead TQFP_EP

19.8

8.3

2

°C/W

resistance through heat sink path.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.