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HSMA-C540 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HSMA-C540 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
8 / 8 page Convective IR Reflow Soldering For more information on solder- ing and pick and place, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components and Application Note 1217 Pick and Place and Soldering of the Agilent HSMx-C540, HSMx-C220 Sur- face Mount LEDs respectively. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the con- dition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. Intensity Bin Limits (mcd @ 20 mA) Bin ID Min. Max. A30 40 B40 50 C50 65 D65 85 E 85 110 F 110 140 G 140 180 H 180 240 J 240 310 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Tolerance of each minimum and maximum = ± 15% Color Bin Limits (nm @ 20 mA) Color Bin ID Min. Max. Category Blue 0 full dist. 1 460 464 2 464 468 3 468 472 4 472 476 5 476 480 Green 0 full dist. 3 520 525 4 525 530 5 530 535 6 535 540 Amber 0 full dist. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 Red no color binning Tolerance of each bin limit = ± 0.5 nm www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 271 2451 India, Australia, New Zealand: (+65) 271 2394 Japan: (+81 3) 3335-8152(Domestic/Interna- tional), or 0120-61-1280(Domestic Only) Korea: (+65) 271 2194 Malaysia, Singapore: (+65) 271 2054 Taiwan: (+65) 271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-5794EN June 14, 2002 5988-7125EN |
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