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HSMP-381C Datasheet(PDF) 10 Page - Agilent(Hewlett-Packard) |
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HSMP-381C Datasheet(HTML) 10 Page - Agilent(Hewlett-Packard) |
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10 / 12 page  10 Assembly Information SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 27 (dimensions are in inches). This layout provides ample allowance for package placement by auto- mated assembly equipment without adding parasitics that could impair performance. 0.026 0.035 0.07 0.016 Figure 27. PCB Pad Layout (dimensions in inches). SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323 package, will reach solder reflow temperatures faster than those with a greater mass. HP’s SOT-323 diodes have been qualified to the time-temperature profile shown in Figure 28. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 °C. These parameters are typical for a surface mount assembly process for HP SOT-323 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. TIME (seconds) T MAX 0 0 50 100 150 200 250 60 Preheat Zone Cool Down Zone Reflow Zone 120 180 240 300 Figure 28. Surface Mount Assembly Profile. |
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