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HSMP-489B Datasheet(PDF) 1 Page - Agilent(Hewlett-Packard) |
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HSMP-489B Datasheet(HTML) 1 Page - Agilent(Hewlett-Packard) |
1 / 12 page Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) Technical Data Features • Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation • Surface Mount SOT-323 (SC-70)Package Single and Pair Versions Tape and Reel Options Available • Low Failure in Time (FIT) Rate* * For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) Description/Applications The HSMP-381B/C/E/F series is specifically designed for low distortion attenuator applications. The HSMP-386B/C/E/F series is a general purpose PIN diode designed for low current attenua- tors and low cost switches. The HSMP-389B/C/E/ F series is optimized for switching applica- tions where low resistance at low current, and low capacitance are required. The HSMP-48XB series is special products featuring ultra low parasitic inductance in the SOT- 323 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-323 PIN diodes. The HSMP-481B diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP-482B diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-489B is optimized for low current switch- ing applications up to 3 GHz. COMMON CATHODE F COMMON ANODE E SERIES C SINGLE B DUAL ANODE 482B / 489B DUAL CATHODE 481B HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F HSMP-481B, -482B, -489B Absolute Maximum Ratings[1], T C = + 25°C Symbol Parameter Unit Absolute Maximum If Forward Current (1 µs Pulse) Amp 1 Piv Peak Inverse Voltage V Same as V BR T J Junction Temperature °C 150 T STG Storage Temperature °C -65 to 150 θ jc Thermal Resistance[2] °C/W 300 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = 25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. |
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