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A3988 Datasheet(PDF) 9 Page - Allegro MicroSystems

Part No. A3988
Description  Quad DMOS Full Bridge PWM Motor Driver
Download  13 Pages
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Manufacturer  ALLEGRO [Allegro MicroSystems]
Direct Link  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

A3988 Datasheet(HTML) 9 Page - Allegro MicroSystems

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Quad DMOS Full Bridge PWM Motor Driver
A3988
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
U1
CIN1
CVDD1
VDD
OUT1A
GND
GND
GND
CIN3
CCP
OUT1B
VBB
OUT2B
OUT2A
OUT3A
OUT3B
OUT4B
OUT4A
CVDD2
RS3
RS1
RS4
RS2
CVCP
CIN2
Motor Configurations
For applications that require either a
stepper/dc motor driver or dual dc motor driver, Allegro offers the
A3989 and A3995. These devices are offered in the same 36 pin
QFN package as the A3988. The dc motor drivers are capable of
supplying 2.4 A at 36 V. Commutation is done with a standard
phase/enable logic interface. Please refer to the Allegro website
for further information and datasheets about those devices.
DC Motor Control
Each of the 4 full bridges has independent
PWM current control circuitry that makes the A3988 capable of
driving up to four dc motors at currents up to 1.2 A. Control of
the dc motors is accomplished by tying the I0, I1 pins together
creating an equivalent ENABLE function with maximum current
defined by the voltage on the corresponding VREF pin. The dc
motors can be driven via a PWM signal on this enable signal, or
on the corresponding PHASE pin. Motor control includes for-
ward, reverse, and coast.
Layout
The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3988 must be soldered directly onto the board. On the under-
side of the A3988 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding
In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground, located very close to the
device. By making the connection between the exposed thermal
pad and the groundplane directly under the A3988, that area
becomes an ideal location for a star ground point.
A low impedance ground will prevent ground bounce during
high current operation and ensure that the supply voltage remains
stable at the input terminal. The recommended PCB layout shown
in the diagram below, illustrates how to create a star ground
under the device, to serve both as low impedance ground point
and thermal path.
Figure 6. Printed circuit board layout with typical application circuit, shown at right. The copper area directly under the
A3988 (U1) is soldered to the exposed thermal pad on the underside of the device. The thermal vias serve also as electrical
vias, connecting it to the ground plane on the other side of the PCB , so the two copper areas together form the star ground.
EV package layout shown
VBB
CVDD1
CVDD2
CCP
CVCP
CIN3
RS1
RS2
PAD
1
A3988
CIN2
CIN1
RS3
RS4
I13
OUT3A
SENSE3
OUT3B
VBB2
OUT4B
SENSE4
OUT4A
I14
I04
OUT1A
SENSE1
OUT1B
VBB1
OUT2B
SENSE2
OUT2A
PHASE4
Applications Information
PCB
Thermal Vias
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
Solder
A3988


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