134 RGE Devices
Raychem Circuit Protection Devices
RGE
Radial Leaded
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RGE Product Data
Now that you have selected your RGE device, please review the
device’s characteristics in this section to verify that the device will
perform as required.
Initial
Post-trip
Max. time
resistance
resistance
Part
IH
IT
to trip (s)
Pd
R min.
R1 max .
Number
(A)
(A)
at 5 x IH
(W)
(
Ω )( Ω )
RGE300
3.0
5.1
2.0
2.3
0.034
0.105
RGE400
4.0
6.8
3.5
2.4
0.020
0.063
RGE500
5.0
8.5
3.6
2.6
0.014
0.044
RGE600
6.0
10.2
5.8
2.8
0.009
0.030
RGE700
7.0
11.9
8.0
3.0
0.006
0.021
RGE800
8.0
13.6
9.0
3.0
0.005
0.018
RGE900
9.0
15.3
12.0
3.3
0.004
0.015
RGE1000
10.0
17.0
12.5
3.3
0.003
0.012
RGE1100
11.0
18.7
13.5*
3.7
0.003
0.010
RGE1200
12.0
20.4
16.0
4.2
0.002
0.009
RGE1400
14.0
23.8
20.0
4.6
0.002
0.008
IH = Hold current—maximum current at which the device will not trip at 25°C.
IT = Trip current—minimum current at which the device will always trip at 25°C.
Pd = Typical power dissipation—typical amount of power dissipated by the device when in tripped state in 25°C still air.
R min. = Minimum device resistance at 25°C prior to tripping.
R max. = Maximum device resistance at 25°C prior to tripping.
R1 max. = Maximum device resistance at 25°C measured 1 hour post trip.
* Device tested at 60 A.
Electrical characteristics (25°C)
Physical characteristics
Lead material
RGE300—RGE1100: Tin lead-plated copper, 20 AWG,
∅ 0.81 mm/0.032 in
RGE1200—RGE1400: Tin lead-plated copper, 18AWG,
∅ 1.0 mm/0.04 in
Soldering characteristics
Solderability per ANSI/J-STD-002
Solder heat withstand per IEC 68-2-20:
RGE300, Test Tb; should be soldered to the printed circuit in less than
4 seconds at maximum temperature of 260
°C ± 5°.
RGE500—RGE1400, Test Tb; can withstand 10 seconds at 260
°C ±5°.
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
Note: Devices are not designed to be placed through a reflow process.
Agency recognitions
CSA
File # CA 78165C
TU
¨ V
Certificate # R9677540
UL
File # E74889
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RGE(7)
1/15/99 11:16 AM
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