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FDW254P Datasheet(HTML) 2 Page - Fairchild Semiconductor

Part No. FDW254P
Description  P-Channel 1.8V Specified PowerTrench MOSFET
Download  5 Pages
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Maker  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
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FDW254P Datasheet(HTML) 2 Page - Fairchild Semiconductor

   
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FDW254P Rev. D (W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250
µA
–20
V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
ID = –250
µA, Referenced to 25°C
–11
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –16 V,
VGS = 0 V
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = –8 V,
VDS = 0 V
–100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = 8 V
VDS = 0 V
100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250
µA
–0.4
–0.6
–1.5
V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
ID = –250
µA, Referenced to 25°C
2
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –4.5 V,
ID = –9.2 A
VGS = –2.5 V,
ID = –7.9 A
VGS = –1.8 V,
ID = –6.5 A
VGS=–4.5 V, ID =–9.2 A, TJ=125
°C
9
11
14
12
12
15
21.5
18
m
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–50
A
gFS
Forward Transconductance
VDS = –5 V,
ID = –9.2 A
54
S
Dynamic Characteristics
Ciss
Input Capacitance
5878
pF
Coss
Output Capacitance
994
pF
Crss
Reverse Transfer Capacitance
VDS = –10 V,
V GS = 0 V,
f = 1.0 MHz
559
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
15
27
ns
Tr
Turn–On Rise Time
15
27
ns
Td(off)
Turn–Off Delay Time
210
336
ns
tf
Turn–Off Fall Time
VDD = –10 V,
ID = –1 A,
VGS = –4.5 V,
RGEN = 6
100
160
ns
Qg
Total Gate Charge
60
96
nC
Qgs
Gate–Source Charge
7
nC
Qgd
Gate–Drain Charge
VDS = –10 V,
ID = –9.2 A,
VGS = –4.5 V
13
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–1.2
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –1.2 A (Note 2)
–0.5
–1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) RθJA is 96°C/W (steady state) when mounted on a 1 inch² copper pad on FR-4.
b) RθJA is 208°C/W (steady state) when mounted on a minimum copper pad on FR-4.
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0%


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