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TAS5182DCAR Datasheet(PDF) 11 Page - Texas Instruments |
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TAS5182DCAR Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 18 page  TAS5182 SLES045E - JUNE 2002 - REVISED MAY 2004 www.ti.com 11 Board configuration: D 1R0 resistors on SHS and GLS connections D GV DD = 12 V, PVDD = 40 V D 10BQ060 voltage clamp on output node D TT snubbers: L = 75 nH, C = 10 nF, R = 5.4 Ω OC_HIGH VRFILT = 1.8 V TAS5182 9 8 VOC Figure 5. Overcurrent Configuration Circuit OC_LOW 27 V-HBRIDGE V-HBRIDGE 220 k W 220 k W 22 k W 22 k W 10 k W 10 k W 1 M W 1 M W Overtemperature Programming Circuit The TAS5182 device features a temperature protection system that uses an external negative temperature coefficient (NTC) resistor as a temperature sensor. Figure 6 shows a typical application. Figure 6. Temperature Sensing Circuit TEMP DVDD TAS5182 3 28 DVSS 4 R(NTC) 47 k W DVDD Supply R1 16 k W The temperature protection system has two trigger limits: OT warning and OT error. OT warning occurs when the voltage at the TEMP terminal is approximately 36% of DVDD. OT error occurs when the voltage at the TEMP terminal is approximately 23% of DVDD. OT warning is decoded when ERR0 = 0, ERR1 = 1, and SHUTDOWN = 1. OT error is decoded when ERR0 = 0, ERR1 = 1, and SHUTDOWN = 0. The user for a particular application determines the values of R1 and RNTC. Typical values are R1 = 16 k Ω and RNTC = 47 kΩ. THERMAL INFORMATION The thermally enhanced DCA package is based on the 56-pin HTSSOP, but includes a thermal pad (see Figure 7) to provide an effective thermal contact between the IC and the PCB. Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220 type packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages, however, have two shortcomings: they do not address the low profile requirements (< 2 mm) of many of today’s advanced systems and they do not offer a terminal count high enough to accommodate increasing integration. However, traditional low-power, surface-mount packages require power-dissipation derating that severely limits the usable range of many high-performance analog circuits The PowerPAD t package (thermally enhanced HTSSOP) combines fine-pitch, surface-mount technology with thermal performance comparable to much larger power packages. The PowerPAD package is designed to optimize the heat transfer to the PCB. Because of the small size and limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered to the PCB, good power dissipation in the ultrathin, fine-pitch, surface-mount package can be reliably achieved. See Reference 4 for recommended soldering procedure. THERMAL DATA PARAMETER MIN TYP MAX UNIT Junction temperature, TJ(SD) 150 _C Operating temperature, TC Commercial 0 25 70 _C pg p , Industrial -40 25 85 _C Thermal resistance, θjc Pad with solder (1) 0.27 _C/W Thermal resistance, θja 21.17 _C/W Thermal resistance, θjc Pad without solder (1) 0.27 _C/W Thermal resistance, θja 36.42 _C/W |
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