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MC10E142FNR2G Datasheet(PDF) 5 Page - ON Semiconductor |
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MC10E142FNR2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 8 page MC10E142, MC100E142 http://onsemi.com 5 Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9) Symbol Characteristic −40°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max fSHIFT Maximum Toggle Frequency 700 900 700 900 700 900 MHz tPLH tPHL Propagation Delay to Output CLK MR 600 600 800 800 1000 1000 600 600 800 800 1000 1000 600 600 800 800 1000 1000 ps tS Setup Time D SEL 50 300 −100 150 50 300 −100 150 50 300 −100 150 ps tH Hold Time D SEL 300 75 100 150 300 75 100 150 300 75 100 150 ps tSKEW Within-Device Skew (Note 10) D to Q 75 75 75 ps tRR Reset Recovery Time 900 700 900 700 900 700 ps tSKEW Within-Device Skew (Note 10) 75 75 75 ps tJITTER Random Clock Jitter (RMS) < 1 < 1 < 1 ps tr, tf Rise/Fall Times (20 - 80%) 300 525 800 300 525 800 300 525 800 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary −0.46 V / +0.06 V. 100 Series: VEE can vary −0.46 V / +0.8 V. 10.Within-device skew is defined as identical transitions on similar paths through a device. Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Driver Device Receiver Device QD Q D Zo = 50 W Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V |
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