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MC100EP35DTR2G Datasheet(PDF) 10 Page - ON Semiconductor

Part No. MC100EP35DTR2G
Description  3.3V / 5V ECL JK Flip−Flop
Download  11 Pages
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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 10 page
background image
MC10EP35, MC100EP35
http://onsemi.com
10
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
0.80
1.10
0.031
0.043
D
0.05
0.15
0.002
0.006
F
0.40
0.70
0.016
0.028
G
0.65 BSC
0.026 BSC
L
4.90 BSC
0.193 BSC
M
0
6
0
6
___
_
SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X
L/2
−U−
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
8x
REF
K
IDENT
K
0.25
0.40
0.010
0.016
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.




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