MC74HCT244A

http://onsemi.com

5

ORDERING INFORMATION

Device

Package

MC74HCT244AN

PDIP−20

18 Units / Rail

MC74HCT244ANG

PDIP−20

(Pb−Free)

MC74HCT244ADW

SOIC−20

38 Units / Rail

MC74HCT244ADWG

SOIC−20

(Pb−Free)

MC74HCT244ADWR2

SOIC−20

1000 / Tape & Reel

MC74HCT244ADWR2G

SOIC−20

(Pb−Free)

MC74HCT244ADTR2

TSSOP−20*

2500 / Tape & Reel

MC74HCT244ADTR2G

TSSOP−20*

MC74HCT244AF

SOEIAJ−20

40 Units / Rail

MC74HCT244AFG

SOEIAJ−20

(Pb−Free)

MC74HCT244AFEL

SOEIAJ−20

2000 / Tape & Reel

MC74HCT244AFELG

SOEIAJ−20

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*These packages are inherently Pb−Free.

MARKING DIAGRAMS

PDIP−20

SOIC−20W

TSSOP−20

SOEIAJ−20

20

1

74HCT244A

AWLYWWG

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

G or

G = Pb−Free Package

(Note: Microdot may be in either location)

1

20

HCT

244A

ALYW

G

G

20

1

HCT244A

AWLYYWWG

1

20

MC74HCT244AN

AWLYYWWG