MC74HC164A

http://onsemi.com

9

PACKAGE DIMENSIONS

SOIC−14

CASE 751A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

G

14

8

7

1

M

0.25 (0.010)

S

B

M

0.25 (0.010)

T

−T−

F

SEATING

PLANE

K

C

J

M

_

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

8.55

8.75

0.337

0.344

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.228

0.244

R

0.25

0.50

0.010

0.019

__

__

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

7X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.