MC74HC165ADTR2G datasheet(9/12 Pages) ONSEMI

Part #	MC74HC165ADTR2G

Description	8?묪it Serial or Parallel?묲nput/ Serial?뭀utput Shift Register High?뭁erformance Silicon?묰ate CMOS

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MC74HC165A

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9

PACKAGE DIMENSIONS

PDIP−16

N SUFFIX

CASE 648−08

ISSUE T

SOIC−16

D SUFFIX

CASE 751B−05

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS

WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE

MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

−A−

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

9

16

K

PLANE

−T−

M

A

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.740

0.770

18.80

19.55

B

0.250

0.270

6.35

6.85

C

0.145

0.175

3.69

4.44

D

0.015

0.021

0.39

0.53

F

0.040

0.70

1.02

1.77

G

0.100 BSC

2.54 BSC

H

0.050 BSC

1.27 BSC

J

0.008

0.015

0.21

0.38

K

0.110

0.130

2.80

3.30

L

0.295

0.305

7.50

7.74

M

0

10

0

10

S

0.020

0.040

0.51

1.01

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

18

16

9

SEATING

PLANE

F

J

M

R X 45

_

G

8 PL

P

−B−

−A−

M

0.25 (0.010)

B S

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010)

A S

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

9.80

10.00

0.386

0.393

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.229

0.244

R

0.25

0.50

0.010

0.019

__

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