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MC100EP210SMNG Datasheet(PDF) 4 Page - ON Semiconductor

Part # MC100EP210SMNG
Description  2.5V 1:5 Dual Differential LVDS Compatible Clock Driver
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EP210SMNG Datasheet(HTML) 4 Page - ON Semiconductor

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MC100EP210S
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4
Table 4. DC CHARACTERISTICS VCC = 2.5 V, VEE = 0 V (Note 2)
−40
°C
25
°C
85
°C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Power Supply Current
150
200
150
200
150
200
mA
VOH
Output HIGH Voltage (Note 3)
1250
1400
1550
1250
1400
1550
1250
1400
1550
mV
VOL
Output LOW Voltage (Note 3)
800
950
1100
800
950
1100
800
950
1100
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 4)
1.2
2.5
1.2
2.5
1.2
2.5
V
RT
Internal Termination Resistor
43
57
43
50
57
43
57
W
IIH
Input HIGH Current
150
150
150
mA
IIL
Input LOW Current
CLK
CLK
−150
−150
150
150
−150
−150
150
150
−150
−150
150
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC.
3. All loading with 100
W across LVDS differential outputs.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 5. AC CHARACTERISTICS VCC = 2.375 to 2.625 V, VEE = 0 V (Note 5)
−40
°C
25
°C
85
°C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
fmaxLVDS/
LVPECL
Maximum Frequency
(See Figure 2. Fmax/JITTER)
> 1
> 1
> 1
GHz
tPLH
tPHL
Propagation Delay
425
525
625
450
550
650
475
575
675
ps
tskew
Within−Device Skew (Note 6)
Device−to−Device Skew (Note 7)
Duty Cycle Skew (Note 8)
20
85
80
25
160
100
20
85
80
25
160
100
20
85
80
35
160
100
ps
tJITTER
RMS Random Clock Jitter
0.2
< 1
0.2
< 1
0.2
< 1
ps
VPP
Minimum Input Swing
150
800
1200
150
800
1200
150
800
1200
mV
tr/tf
Output Rise/Fall Time (20%−80%)
50
130
200
75
150
225
80
160
230
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Measured with 400 mV source, 50% duty cycle clock source. All loading with 100
W across differential outputs.
6. Skew is measured between outputs under identical transitions of similar paths through a device.
7. Device−to−Device skew for identical transitions at identical VCC levels.
8. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.


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