1998 Jun 25

6

Philips Semiconductors

Product specification

Damper diodes

BY558; BY578

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD115

97-10-14

Hermetically sealed glass package; axial leaded; 2 leads

SOD115

UNIT

b

max.

mm

1.35

D

max.

G

max.

27

6.0

5.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

Note

1. The marking band indicates the cathode.

(1)

ka



0

2.5

5 mm

scale