1996 Sep 26

3

Philips Semiconductors

Product specification

Miniature high-voltage soft-recovery

rectifier

BY614

ELECTRICAL CHARACTERISTICS

THERMAL CHARACTERISTICS

Note

1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper

≥40 µm, see Fig.5.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

forward voltage

−−

6V

reverse current

−−

3

µA

recovery charge

see Fig.6

−−

1nC

fall time

see Fig.6

100

−−

ns

reverse recovery time

see Fig.6

−−

300

ns

diode capacitance

−

2

−

pF

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

100

K/W

thermal resistance from junction to ambient

note 1

155

K/W