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BYD52J Datasheet(PDF) 3 Page - NXP Semiconductors |
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BYD52J Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 1998 Dec 03 3 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYD52 series THERMAL CHARACTERISTICS Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper layer ≥40 µm, pitch 5 mm; see Fig.6. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 150 K/W |
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