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NCP502SQ15T1G Datasheet(PDF) 7 Page - ON Semiconductor |
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NCP502SQ15T1G Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 11 page NCP502, NCP502A http://onsemi.com 7 APPLICATIONS INFORMATION A typical application circuit for the NCP502/A series is shown in Figure 1, front page. Input Decoupling (C1) A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP502/A package. Higher values and lower ESR will improve the overall line transient response. If large line or load transients are not expected, then it is possible to operate the regulator without the use of a capacitor. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Output Decoupling (C2) The NCP502/A is a stable regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 5.0 W can thus safely be used. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K Enable Operation The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal As power across the NCP502/A increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP502/A has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: PD + TJ(max) *TA R qJA If junction temperature is not allowed above the maximum 125 °C, then the NCP502/A can dissipate up to 250 mW @ 25 °C. The power dissipated by the NCP502/A can be calculated from the following equation: Ptot + [Vin *Ignd (Iout)] ) [Vin * Vout] *Iout or VinMAX + Ptot ) Vout * Iout Ignd ) Iout If an 80 mA output current is needed then the ground current from the data sheet is 40 mA. For an NCP502/A (3.0 V), the maximum input voltage will then be 6.12 V. |
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