NCP1203

http://onsemi.com

3

Figure 2. Internal Circuit Architecture

OVERLOAD

MANAGEMENT

UVLO HIGH AND LOW

INTERNAL REGULATOR

±250 mA

HV CURRENT

SOURCE

8

7

6

5

HV

NC

Drv

1

2

3

4

Q FLIP−FLOP

DCmax = 80%

Q

250 ns

L.E.B.

40−60−100 kHz

CLOCK

−

+

−

+

80 k

20 k

57 k

1 V

CURRENT

SENSE

GROUND

FB

Adj

24 k

25 k

+

−

RESET

1.2 V

SKIP CYCLE

COMPARATOR

SET

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply Voltage

16

V

−

−0.3 to 10

V

10 V ESD diodes are activated

−

5.0

mA

Thermal Resistance, Junction−to−Air, PDIP−8 Version

Thermal Resistance, Junction−to−Air, SOIC Version

100

178

°C/W

°C/W

Maximum Junction Temperature

150

°C

Temperature Shutdown

−

170

°C

Hysteresis in Shutdown

−

30

°C

Operating Temperature Range

−40 to +125

°C

Storage Temperature Range

−60 to +150

°C

−

2.0

kV

ESD Capability, Machine Model

−

200

V

−

450

V

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.