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ADT7517 Datasheet(PDF) 9 Page - Analog Devices |
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ADT7517 Datasheet(HTML) 9 Page - Analog Devices |
9 / 44 page ADT7516/ADT7517/ADT7519 Rev. B | Page 9 of 44 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VDD to GND –0.3 V to +7 V Analog Input Voltage to GND –0.3 V to VDD + 0.3 V Digital Input Voltage to GND –0.3 V to VDD + 0.3 V Digital Output Voltage to GND –0.3 V to VDD + 0.3 V Reference Input Voltage to GND –0.3 V to VDD + 0.3 V Operating Temperature Range –40°C to +120°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Power Dissipation1 (TJ max – TA)/θJA Thermal Impedance2 θJA Junction-to-Ambient 105.44°C/W θJC Junction-to-Case 38.8°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 6 min maximum IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 8 min maximum 1 Values relate to the package being used on a 4-layer board. 2 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air cooled PCB- mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4. I2C Address Selection ADD Pin I2C Address Low 1001 000 Float 1001 010 High 1001 011 ESD CAUTION |
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