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NCP2890AFCT2G Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCP2890AFCT2G
Description  1.0 Watt Audio Power Amplifier
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP2890AFCT2G Datasheet(HTML) 3 Page - ON Semiconductor

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NCP2890, NCV2890
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3
PIN DESCRIPTION
9−Pin Flip−Chip
CSP
Micro8
Type
Symbol
Description
A1
4
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to
the feedback resistor Rf and to the input resistor Rin.
A2
5
O
OUTA
Negative output of the NCP2890. Connected to the load and to the feedback
resistor Rf.
A3
3
I
INP
Positive input of the first amplifier, receives the common mode voltage.
B1
NA
I
VM_P
Power Analog Ground.
B2
7
I
VM
Core Analog Ground.
B3
6
I
Vp
Positive analog supply of the cell. Range: 2.2 V−5.5 V.
C1
2
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2
8
O
OUTB
Positive output of the NCP2890. Connected to the load.
C3
1
I
SHUTDOWN
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
Vp
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
Input Voltage
Vin
−0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
Operating Ambient Temperature
TA
−40 to +85
°C
Max Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Thermal Resistance Junction−to−Air
Micro8
9−Pin Flip−Chip CSP
RqJA
230
(Note 3)
°C/W
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
8000
>250
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160
°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 10.
3. For the 9−Pin Flip−Chip CSP package, the RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with
50 mm2 total area and also 135
°C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and
all need to be connected to optimize the power dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k
W resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.


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