NCP5208

http://onsemi.com

2

Figure 2. Simplified Functional Block Diagram

VDDQ

VDDQ

R

AVIN

AVIN

AVIN

R/50

R

SD

PVIN

M0

M1

GND

−

+

POK

VTT

VFB

VTT

+

−

EN

AVIN

PVIN

EN

EN

PIN FUNCTION DESCRIPTION

Pin

Symbol

Description

1

POK

Open−drain VTT Power OK output

2

GND

Ground

3

VFB

Remote sensing Feedback pin for regulating VTT

4

SD

Active low shutdown pin to tri−state VTT output, this pin is pulled high internally

5

VDDQ

Reference input for VTT regulator

6

AVIN

Analog supply input, this powers all the internal control circuitry

7

PVIN

Power supply input, this provides the rail voltage for the VTT output

8

VTT

Termination Regulator output

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

AVIN, PVIN, VDDQ, VFB, VTT to GND

−

−0.3, 6.0

V

Input/Output Pins

SD

−0.3, 6.0

V

Open Drain Output Pins

POK

−0.3, 6.0

V

Thermal Characteristics

SOIC−8 Package − Thermal Resistance, Junction−to−Air

151

°C/W

Operating Junction Temperature Range

−10 to +150

°C

Operating Ambient Temperature Range

0 to +70

°C

Storage Temperature Range

−55 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Human Body Model (HBM)

v2.0 kV per JEDEC standard: JESD22–A114.

Machine Model (MM)

v200 V per JEDEC standard: JESD22–A115.

2. Latchup Current Maximum Rating:

"150 mA per JEDEC standard: JESD78.